Compact and low loss supercapacitors in a novel encapsulation

kuva 7.jpg

Vertically aligned carbon nanotubes (VACNTs) has been successfully grown on highly oriented graphite papers with a covalent bonding structure. The covalent bonding feature ensures high frequency response property (cut-off frequency up to 2 kHz, volumetric capacitance at 120 Hz more than 300 mF cm-3) with aqueous electrolytes, 100 nA level equilibrium leakage current and extremely quick stabilization to equilibrium in less than 2 minutes with an ionic liquid electrolyte. Read more

Posted on January 14, 2019 .

Autonomous & wireless sensor node development platform

kuva 4.png

Key industry domains (SHM, IWSN, wearable electronic) need self-powered wireless nodes to operate their unique sensing application with very low maintenance. The conversion of surrounding mechanical vibration into usable energy is a great opportunity to power up such fantastic sensors. Read more

Posted on January 14, 2019 .

Fan-out Panel Level Packaging (FOPLP)

kuva1.jpg

Panel Level packaging (PLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration also larger substrates formats are targeted. Fan-out Wafer Level manufacturing is currently done on wafer level up to 12”/300 mm and 330 mm diameter respectively. For higher productivity and therewith lower costs, larger form factors are introduced. Read more

Posted on January 14, 2019 .

CAIRDAC Autonomous Leadless Pacemaker powered by heart beats

kuva 5.png

smart-MEMPHIS has proven, in vitro, the feasibility of a leadless pacemaker powered by the energy harvested from heart beats. A bulk-MEMS piezoelectric energy harvester has been designed and a specific industrial process has been developed in order to manufacture harvesters fitting inside a pacemaker capsule of less than 1 cm3 and able to extract energy from the low frequency vibrations of cardiac beats. Read more

Posted on January 14, 2019 .

Full wafer poling set up for PZT MEMS

aixACCT had built a full wafer poling set up, which allows to pole PZT materials in order to tune the PZT performance. aixACCT has realized a prototype that offers a technology which quite softly but securely contacts all top electrodes in parallel and all bottom electrode contacts in parallel to a pad size of 200µm x 200µm. The clue is the integrated current limitation which is essential for this technology in order to pole all devices even if a single device fails. Read more

Posted on January 14, 2019 .

HALT for ferroelectrics and piezoelectrics

An Highly Accelerated Life Time test system has been designed and realized, which is the first one specialized for this market segment. Existing test systems are not prepared for the hysteretic behavior of the ferroelectric material as it is the case for PZT. Read more

Posted on January 14, 2019 .

World first direct measurement of piezoelectric parameter e31,f

e31,f is the most important parameter to characterize the properties of a piezoelectric film. Before smart-MEMPHIS project started it has not been possible to measure this parameter directly as non-destructive testing on a full wafer. Using a bending plate principle aixACCT has demonstrated this direct measurement. The direct measurement has been compared to two indirect methods. One is double beam laser interferometry which uses two d33,f measurements on different pad sized to calculate e31,f and to cantilever deflection measurement which can be used to calculate e31,f. Read more

Posted on January 14, 2019 .