Fan-out Panel Level Packaging (FOPLP)

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Panel Level packaging (PLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration also larger substrates formats are targeted. Fan-out Wafer Level manufacturing is currently done on wafer level up to 12”/300 mm and 330 mm diameter respectively. For higher productivity and therewith lower costs, larger form factors are introduced. Read more

Posted on January 14, 2019 .