Fan-out Panel Level Packaging (FOPLP)


Panel Level packaging (PLP) is one of the latest packaging trends in microelectronics. Besides technology developments towards heterogeneous integration also larger substrates formats are targeted. Fan-out Wafer Level manufacturing is currently done on wafer level up to 12”/300 mm and 330 mm diameter respectively. For higher productivity and therewith lower costs, larger form factors are introduced. Read more

Posted on January 14, 2019 .